SK Hynix

SK Hynix is a global leader in semiconductor manufacturing, specializing in DRAM and NAND flash memory. With over three decades of innovation, the company consistently delivers smaller, faster, and lower power semiconductors.

Heejin Chung

Head of Venture Investment

Past deals in Semiconductor

Eliyan

Series B in 2024
Eliyan develops chiplet interconnect technology that enhances AI performance by eliminating memory bottlenecks. This is achieved through high-speed data transfer and low-latency communication, enabling industries to meet growing computational demands.

NeuReality

Series A in 2022
NeuReality is a semiconductor start-up that specializes in designing AI-as-a-service infrastructure to meet the needs of the rapidly expanding AI landscape across cloud, edge, and fog systems. The company develops purpose-built AI-centric architecture, focusing on server-on-chip solutions that reconfigure inference technologies, including computer vision, natural language processing, and recommendation engines. This innovative approach simplifies the implementation of advanced AI functionalities for organizations with limited technical expertise, allowing clients to reduce costs and energy consumption by moving away from traditional CPU-centric models. NeuReality aims to facilitate the adoption of AI technologies across various sectors, making them more accessible and efficient.

d-Matrix

Series A in 2022
D-Matrix is a computing platform dedicated to enhancing artificial intelligence inferencing workloads within data centers. The company aims to create and implement the world's first brain-inspired AI compute engine, catering to a diverse range of inferencing tasks in the expansive cloud and infrastructure edge markets. D-Matrix's innovative approach leverages in-memory computing techniques and addresses the challenges of memory-compute integration through a combination of mixed-signal and digital signal processing methods. This focus on efficiency enables clients to optimize their computing capabilities, particularly in the realms of generative artificial intelligence and large language models.

Elastics.cloud

Corporate Round in 2022
Elastics.cloud specializes in Smart Interconnect technology, focusing on creating efficient and scalable systems. It offers silicon, hardware, and software solutions that utilize the Compute Express Link (CXL) interconnect standard to provide high-performance connectivity across various components.

Movellus

Series B in 2022
Founded in 2014, Movellus designs and manufactures mixed-signal semiconductors for the semiconductor market. Its product portfolio includes clock generators/PLLs, locked loops, programmable oscillators, pulse width modulators, and near threshold analogs. Serving semiconductor and systems companies across AI, networking, and FPGA segments, Movellus operates from San Jose, California with additional offices in Silicon Valley, California; Ann Arbor, Michigan; and Toronto, Canada.

Key Foundry

Acquisition in 2021
Key Foundry is the only dedicated semiconductor foundry company in South Korea established by the foundry business division.

The Ferroelectric Memory Company

Series B in 2020
The Ferroelectric Memory Company (FMC), based in Dresden, Germany, specializes in providing embedded nonvolatile memory solutions to the semiconductor industry. FMC's core technology is based on ferroelectric hafnium oxide (FE-HfO2), enabling ultra-low-power, high-performance, and dense non-volatile storage. This technology, known as FeFET, transforms classical high-k metal-gate transistors into nonvolatile ferroelectric field effect transistors, allowing for easy scaling of microcontrollers from 65nm down to 5nm and beyond. FMC's solutions offer significant advantages, including a 80% reduction in system-on-chip (SoC) cost, a 1000x reduction in write energy per bit, and a 70% overall performance gain. The company's technology is designed to be compatible with cutting-edge technology nodes, making it a future-proof solution for the semiconductor industry.

Intel NAND Memory Business

Acquisition in 2020
Intel NAND Memory Business handles manufacturing and design patents of flash-memory products. Intel NAND Memory Business includes the NAND SSD, the NAND component, and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel NAND Memory Business was acquired by SK hynix for US $9 billion.

Gauss Labs

Corporate Round in 2020
Gauss Labs develops industrial AI software for manufacturing, leveraging extensive machine-generated data to increase visibility and control across production lines. Its platform provides AI-based process monitoring and analytics to support process control, equipment monitoring, sampling optimization, and yield management. The solutions emphasize semiconductor manufacturing, offering advanced process control, statistical process control, and recipe management to monitor and optimize manufacturing processes and improve efficiency and quality.

SiFive

Series E in 2020
SiFive, Inc. is a semiconductor company that specializes in designing and manufacturing chips, particularly focusing on RISC-V architecture. Established in 2015 and headquartered in San Mateo, California, with additional offices in locations such as Oregon, Texas, India, Taiwan, and France, SiFive provides a range of products including multi-core application processors, embedded microcontrollers, and system-on-chip solutions tailored for various applications such as IoT and wearables. The company emphasizes the use of open-source technology to enable faster and more cost-effective hardware development. By offering software development kits, toolchains, and customized silicon products, SiFive aims to democratize access to advanced semiconductor solutions, accelerating innovation for businesses of all sizes.

Inpria

Series C in 2020
Inpria Corporation is a specialized manufacturer based in Corvallis, Oregon, focusing on the design, development, and production of EUV metal oxide photoresists for the semiconductor industry. Founded in 2007, Inpria has established itself as a pioneer in the use of inorganic photoresists and thin films for nanoscale patterning. The company's patented photo-condensed molecular oxides allow for the direct deposition of atomically smooth, dense, and photopatternable metal oxide films from solution. This innovation enhances performance while simplifying processing. Inpria's products are meticulously optimized to meet industry specifications related to resolution, sensitivity, and line width roughness, offering a comprehensive solution that includes photoresists, developers, and ancillary materials to support advanced semiconductor manufacturing.

ZettaStone

Angel Round in 2018
ZettaStone is a solid-state storage technology company that uses flash memory to design and manufacture storage solutions. It offers NAND-compatible controller chips, industrial-grade SSDs, data-center storage modules, and embedded storage systems for industrial, consumer, and data-center applications. Its products enable high-performance, reliable, and scalable data storage across PCs, data centers, industrial automation, telecommunications, transportation, healthcare, finance, and other industries.

Starblaze

Series C in 2018
Starblaze is a manufacturer of advanced solid-state drive (SSD) master chips, catering to both consumer and enterprise markets. The company has independently developed a high-performance, low-power NVMe SSD master controller, which is mass-produced and shipped alongside its firmware solutions. Starblaze's products support various well-known brands that offer high-performance NVMe SSDs. The company provides four distinct solutions: STAR1200C, a high-performance and low-power NVMe option; OC SSD, a customized Open-Channel interface solution for data centers; STAR1200E, an enterprise-level NVMe solution focused on low power and high performance; and DeepSSD, which incorporates AI storage master control to facilitate key-value storage applications in the monitoring sector. Starblaze's technology is designed for data processing-intensive applications, including AI data analysis, enabling the creation of more powerful computer systems.

Reno Sub Systems

Series C in 2017
Reno Sub-Systems, to our longtime semiconductor friends, colleagues and customers around the world. The founding of Reno has been a very gratifying challenge which has brought together many of the best and brightest minds in the field of Semiconductor Process Equipment Instrumentation. At a time when industry consolidation and the tightening of venture capital poses a serious threat to new business formation, the founders of Reno have demonstrated the incredible power of inventing world-class technologies to enable next generation processes. With three brand new and highly disruptive technologies, we are creating a paradigm shift in the industry. At Reno, we believe there is unlimited potential for new discoveries and innovative thinking. As we move forward into the 450mm era, Reno stands at the summit of semiconductor process control equipment technology, ready to set the standards for product performance, worldwide customer support and customer satisfaction.

Exnodes

Seed Round in 2016
Exnodes Inc., established in 2014 and headquartered in Fremont, California, specializes in designing and developing advanced computational imaging and machine learning technologies for the semiconductor industry. The company focuses on rapid detection, identification, and root-cause analysis of nanoscale defects in semiconductor fabrication processes. Exnodes' technology enables increased fabrication yields and resource preservation by leveraging modern sensors, electronics, optics, mechanics, and high-speed digital processing. Its innovative computational parallel inspection (CPI) method uses visible light to achieve an 8.9 nanometer sensitivity breakthrough, allowing for unpatterned wafer inspection without the need for deep ultraviolet (DUV) systems. Exnodes' technology is licensed to semiconductor companies aiming to enhance their product yields and efficiency.

NetSpeed Systems

Series C in 2016
NetSpeed Systems is a company that specializes in providing scalable and coherent Network-on-Chip (NoC) intellectual property (IP) for System-on-Chip (SoC) designers across various markets, including mobile, high-performance computing, and networking. Founded in 2011, the company offers NoC IPs that facilitate significant time-to-market advantages through a system-level approach, extensive user-driven automation, and advanced algorithms. Its technology simplifies the integration of internet protocols, allowing architects and designers to optimize power, performance, and area in application-specific integrated circuits. NetSpeed Systems is led by experienced executives from the semiconductor and networking industries, positioning the company as a key player in the evolving landscape of chip design.

Stratio

Series A in 2015
Stratio, Inc. is a technology company based in Palo Alto, California, that specializes in infrared sensing solutions. Founded in 2013, Stratio has developed groundbreaking products, including LinkSquare, a compact spectrometer, and BeyonSense, the first smartphone-compatible shortwave infrared camera. The company created the world's first germanium-based shortwave infrared sensor, which facilitates the development of portable and affordable infrared devices. Stratio's products are utilized globally by various partners and customers to enhance process efficiency, combat counterfeiting, ensure food safety, and support precision agriculture. The company is also focused on advancing its technology and aims to develop hyper-spectral imaging solutions in the near future.

Link_A_ Media

Acquisition in 2012
Link_A_Media Devices (LAMD) is the new leader in developing and manufacturing custom System-on-Chip (SOC) solutions for peripheral data storage devices, which include hard disk drives (HDDs) and solid-state-drives (SSDs). The SoC solution integrates the Read/Write Channel, disk controller functions, microprocessor(s) and memories, and servo processing for HDD application on a single chip.

Avicena

Avicena Tech specializes in manufacturing advanced optical chip interconnects, operating at ultra-low power and ultra-high speeds (petabit per second). Their innovative technology, based on silicon photonics and other high-volume commercial technologies, enables ultra-dense, low-latency, and low-cost connections between chips. This significantly enhances system performance and efficiency, addressing critical inter-chip communication needs, particularly in applications constrained by traditional electrical interconnects.
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