Lockheed Martin Ventures

Lockheed Martin Ventures, established in 2014, is a venture capital arm of Lockheed Martin Corporation. It focuses on investing in early-stage companies specializing in advanced technologies such as autonomous systems, cybersecurity, space technologies, and artificial intelligence.

Richard F.Ambrose

Executive Vice President

Paul Colonna

President and Chief Investment Officer

Jeff Cunningham

Investor

David Jewell

Communications Director, Aircraft and Logistics Centers

Zachary Ladonis

Analyst

Allan Lockheed

Founder

Chris Moran

Vice President

Alison (Ali) Perez

Investor

Gopal Rajaraman

Investor

John Richmond

Senior Associate

John Sheehan

Vice President and General Manager Commercial Aviation Inspection Service

Frank St John

COO

Sam Stonberg

Investor

Xiaoming Yin

Investor

Past deals in Electronics

Ayar Labs

Series D in 2024
Ayar Labs develops and manufactures high-density electronic-photonic chiplets and lasers, specializing in optical interconnect solutions. Its flagship product, TeraPHY, offers a monolithic in-package optical I/O solution for applications requiring high bandwidth, low latency, and power efficiency. The company's products serve various industries such as artificial intelligence, cloud computing, telecommunications, aerospace, and military.

Q5D Technology

Venture Round in 2024
Q5D automates the manufacture and assembly of wiring looms using advanced robotics, additive manufacturing, and intelligent software. It serves automotive, aerospace, and industrial sectors, helping Original Equipment Manufacturers (OEMs) and Tier 1 suppliers accelerate electrification, enhance reliability, and streamline supply chains.

Anello Photonics

Series B in 2024
Anello Photonics, based in Silicon Valley, specializes in developing advanced sensors that deliver optical gyroscope performance at an affordable price. Founded by experts in silicon photonics and inertial navigation, the company has created a patented technology known as the Anello SiPhOG gyroscope. This innovative sensor leverages an integrated photonic system-on-chip that utilizes a proprietary waveguide process, which simulates the characteristics of optical fiber within a compact chip. Anello's technology aims to redefine navigation systems with next-generation capabilities, positioning the company as a leader in the mass-market sensor industry. The company has garnered support from prominent venture capital firms to propel its growth and technological advancements.

Phoenix Semiconductor

Seed Round in 2024
Phoenix Semiconductor specializes in developing electronic technologies that offer reliable and cost-effective replacements for discontinued semiconductor components. The company addresses challenges posed by obsolescence and supply chain disruptions by ensuring a dependable source of critical microelectronic parts that may be unavailable through traditional distribution channels. Phoenix Semiconductor's expertise lies in creating solutions that allow commercial semiconductor companies to provide secure drop-in replacements, thereby enabling them to meet the ongoing demand for legacy components in a constantly evolving market.

Liquid Instruments

Venture Round in 2024
Liquid Instruments designs and manufactures Moku:Lab, an all-in-one test and measurement platform that blends FPGA-based signal processing with high-speed analog inputs and outputs. The software-configurable hardware enables precise testing, measurement, and advanced digital signal processing, providing flexible, multi-function devices that improve workflow and productivity in manufacturing, defense, and education.

Elve

Series A in 2024
Elve is a manufacturer specializing in high-efficiency, lightweight millimeter wave and near-terahertz power amplifiers designed to enhance wireless connectivity. The company focuses on developing advanced technologies that facilitate fiber-like wireless internet links, thereby improving the overall online experience for users. By integrating agile manufacturing techniques into their vacuum electronic devices, Elve aims to provide innovative solutions that support widespread connectivity in various applications.

Ayar Labs

Series C in 2023
Ayar Labs develops and manufactures high-density electronic-photonic chiplets and lasers, specializing in optical interconnect solutions. Its flagship product, TeraPHY, offers a monolithic in-package optical I/O solution for applications requiring high bandwidth, low latency, and power efficiency. The company's products serve various industries such as artificial intelligence, cloud computing, telecommunications, aerospace, and military.

3D Glass Solutions

Series C in 2023
3D Glass Solutions designs and manufactures glass-based system-in-package electronic packaging devices and components, and provides design and device consultation and prototyping services. The company serves integrated circuit manufacturers, photonic component suppliers, and defense contractors, leveraging glass-enabled systems integration to consolidate components onto a single platform while reducing manufacturing costs. It utilizes APEX Glass technology to fabricate electronic systems with photo-definable glass ceramics, offering low-loss photosensitive processes, through-glass vias, substrate stacking, and photonic integration. These capabilities support applications in wireless infrastructure, aerospace and defense, photonics, sensors, and AI. The business originated in 2006 and is based in Albuquerque, New Mexico.

Lux Semiconductors

Seed Round in 2023
Lux Semiconductors develops crystalline thin-film semiconductors used in flexible integrated circuits and designs metal-core substrates intended to replace traditional organic and glass cores in advanced semiconductor packages. The company's patented platform improves heat dissipation, power delivery, electromagnetic shielding, structural stability, and signal integrity, enabling manufacturers across data-center processors, AI accelerators, aerospace and defense electronics, automotive systems, battery management, and medical devices to overcome performance bottlenecks.

Liquid Instruments

Series B in 2022
Liquid Instruments designs and manufactures Moku:Lab, an all-in-one test and measurement platform that blends FPGA-based signal processing with high-speed analog inputs and outputs. The software-configurable hardware enables precise testing, measurement, and advanced digital signal processing, providing flexible, multi-function devices that improve workflow and productivity in manufacturing, defense, and education.

3D Glass Solutions

Series B in 2021
3D Glass Solutions designs and manufactures glass-based system-in-package electronic packaging devices and components, and provides design and device consultation and prototyping services. The company serves integrated circuit manufacturers, photonic component suppliers, and defense contractors, leveraging glass-enabled systems integration to consolidate components onto a single platform while reducing manufacturing costs. It utilizes APEX Glass technology to fabricate electronic systems with photo-definable glass ceramics, offering low-loss photosensitive processes, through-glass vias, substrate stacking, and photonic integration. These capabilities support applications in wireless infrastructure, aerospace and defense, photonics, sensors, and AI. The business originated in 2006 and is based in Albuquerque, New Mexico.

Anello Photonics

Series A in 2021
Anello Photonics, based in Silicon Valley, specializes in developing advanced sensors that deliver optical gyroscope performance at an affordable price. Founded by experts in silicon photonics and inertial navigation, the company has created a patented technology known as the Anello SiPhOG gyroscope. This innovative sensor leverages an integrated photonic system-on-chip that utilizes a proprietary waveguide process, which simulates the characteristics of optical fiber within a compact chip. Anello's technology aims to redefine navigation systems with next-generation capabilities, positioning the company as a leader in the mass-market sensor industry. The company has garnered support from prominent venture capital firms to propel its growth and technological advancements.

Hidden Level

Venture Round in 2021
Hidden Level develops airspace sensing technologies, specializing in passive radar and drone detection through RF spectrum signal analysis. Its airspace monitoring systems deploy networks of passive sensors to detect and track drones and other aerial vehicles over large geographic areas, supporting critical infrastructure, defense, and public safety customers. The company emphasizes safety through sensing, offering services that cover classical systems engineering, data modeling and analysis, field testing, and full product lifecycle management, including PCB design. Its solutions enable monitoring of low-altitude air traffic while maintaining privacy in compliance with applicable regulations.

Ayar Labs

Series B in 2020
Ayar Labs develops and manufactures high-density electronic-photonic chiplets and lasers, specializing in optical interconnect solutions. Its flagship product, TeraPHY, offers a monolithic in-package optical I/O solution for applications requiring high bandwidth, low latency, and power efficiency. The company's products serve various industries such as artificial intelligence, cloud computing, telecommunications, aerospace, and military.

Ayar Labs

Venture Round in 2020
Ayar Labs develops and manufactures high-density electronic-photonic chiplets and lasers, specializing in optical interconnect solutions. Its flagship product, TeraPHY, offers a monolithic in-package optical I/O solution for applications requiring high bandwidth, low latency, and power efficiency. The company's products serve various industries such as artificial intelligence, cloud computing, telecommunications, aerospace, and military.

3D Glass Solutions

Series B in 2019
3D Glass Solutions designs and manufactures glass-based system-in-package electronic packaging devices and components, and provides design and device consultation and prototyping services. The company serves integrated circuit manufacturers, photonic component suppliers, and defense contractors, leveraging glass-enabled systems integration to consolidate components onto a single platform while reducing manufacturing costs. It utilizes APEX Glass technology to fabricate electronic systems with photo-definable glass ceramics, offering low-loss photosensitive processes, through-glass vias, substrate stacking, and photonic integration. These capabilities support applications in wireless infrastructure, aerospace and defense, photonics, sensors, and AI. The business originated in 2006 and is based in Albuquerque, New Mexico.

Tempo Automation Holdings

Series C in 2019
Tempo Automation Holdings, established in 2013 and headquartered in San Francisco, specializes in manufacturing low-volume electronics products. The company's core business involves designing and assembling printed circuit boards (PCBs) using a unique, software-automated platform. This platform enables Tempo to provide unparalleled speed, quality, and transparency, particularly during the critical prototype and new product introduction stages. Serving leading innovators across industries such as aerospace, medical technology, and automotive, Tempo Automation empowers its customers to accelerate product development and time to market.

IQ-Analog Corporation

Series B in 2016
IQ-Analog Corporation specializes in high-speed data conversion solutions. Established in 2004 and headquartered in San Diego, California, the company offers a range of intelligent analog products including precision ADCs, DACs, transceivers, PLLs, regulators, and sensors.

Newlans

Series B in 2014
Newlans Inc., established in 2003 and based in Acton, Massachusetts, specializes in programmable analog signal processing solutions for the semiconductor industry. As a fabless company, Newlans develops high-quality, programmable Silicon-on-Insulator (SOI) capacitors and components, primarily serving smartphone original equipment manufacturers and radio frequency front-end module suppliers. Its products enable tunable RFFE solutions, addressing the increasing demand for flexible and efficient RF front-ends in 4G LTE devices.

Xytrans

Series D in 2006
Xytrans designs and manufactures high-frequency transceivers and outdoor units for global leaders in wireless broadband communications.

Xytrans

Series C in 2004
Xytrans designs and manufactures high-frequency transceivers and outdoor units for global leaders in wireless broadband communications.
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