Par Equity

Par Equity is a venture capital firm established in 2008 and headquartered in Edinburgh, United Kingdom. The firm focuses on investing in early-stage technology companies that demonstrate high growth potential, primarily within the regions of Northern England, Northern Ireland, and Scotland. Par Equity aims to support innovative businesses that contribute to the advancement of the technology sector in the North of the UK.

Paul Atkinson

Partner

Andrew Castell

Partner

Claire Cramm

Investment Manager

Tom Croy

Investment Director

Robert Higginson

Partner

Oliver Johnston-Watt

Investment Analyst

Aidan MacMillan

Investment Director

Alastair Moore

Senior Investment Manager

Paul Munn

Partner

Andrew Noble

Partner

Elizabeth Young Ph.D

Investment Manager

Past deals in 3D Printing

Partful

Series A in 2024
Partful is a developer of software that creates 3D exploded views of products and parts, aimed at enhancing the efficiency of maintenance and repair operations. Its platform offers an interactive 3D experience, enabling users to quickly identify, locate, and order the correct parts. This functionality helps businesses reduce downtime, improve safety, and achieve cost savings. By presenting products in a visually engaging format, Partful facilitates a more effective approach to parts management and ordering.

Partful

Venture Round in 2023
Partful is a developer of software that creates 3D exploded views of products and parts, aimed at enhancing the efficiency of maintenance and repair operations. Its platform offers an interactive 3D experience, enabling users to quickly identify, locate, and order the correct parts. This functionality helps businesses reduce downtime, improve safety, and achieve cost savings. By presenting products in a visually engaging format, Partful facilitates a more effective approach to parts management and ordering.

Partful

Seed Round in 2022
Partful is a developer of software that creates 3D exploded views of products and parts, aimed at enhancing the efficiency of maintenance and repair operations. Its platform offers an interactive 3D experience, enabling users to quickly identify, locate, and order the correct parts. This functionality helps businesses reduce downtime, improve safety, and achieve cost savings. By presenting products in a visually engaging format, Partful facilitates a more effective approach to parts management and ordering.

iGii

Seed Round in 2020
iGii specializes in the development of innovative manufacturing processes for producing high-performance, pure 3D graphene foam. This foam can be applied directly onto various surfaces at room temperature and within seconds, making it a highly efficient solution for manufacturers. iGii's customizable and scalable foam enhances the electrochemically active surface area, significantly improving the performance of supercapacitors with fast charging capabilities and extended battery life. By addressing common issues related to cost, variability, and stability in the production process, iGii provides a unique offering that supports advancements in energy storage technology.

Optoscribe

Debt Financing in 2020
Optoscribe’s unique 3D glass-based photonic integrated circuit platform is ideally suited for creating custom transceiver fiber coupling and attaching solutions designed to specifically address the challenges of individual optical transceiver architectures and configurations. Designed to enable compact and robust optical interconnects, Optoscribe’s platform revolutionise the footprint and form factor of assemblies and dramatically increase the amount of data transferred across networks. This in turn minimises network costs whilst maximising cable performance. We use proven and tested manufacturing processes to enable simple volume scalability, and ensure that our products are designed to meet the stringent needs of communications markets. Easy to integrate into a wide range of advanced communications applications the 3D nature of Optoscribe’s platform lends itself to address fiber density issues as speed (bandwidth) moves from 400Gb/s to 800Gb/s and beyond. It also supports advanced space division multiplexed transmission using the latest fibers, more specifically, Single Mode Fibers (SMF), Multimode Fibers (MMF) Multicore Fibers (MCF) and Few Mode Fibers (FMF). The 3D fiber coupling solutions can address challenges in a wide variety of transceivers including Silicon Photonics, VCSEL and DFB based designs and coupling to a range of standard fiber architectures..

Optoscribe

Venture Round in 2020
Optoscribe’s unique 3D glass-based photonic integrated circuit platform is ideally suited for creating custom transceiver fiber coupling and attaching solutions designed to specifically address the challenges of individual optical transceiver architectures and configurations. Designed to enable compact and robust optical interconnects, Optoscribe’s platform revolutionise the footprint and form factor of assemblies and dramatically increase the amount of data transferred across networks. This in turn minimises network costs whilst maximising cable performance. We use proven and tested manufacturing processes to enable simple volume scalability, and ensure that our products are designed to meet the stringent needs of communications markets. Easy to integrate into a wide range of advanced communications applications the 3D nature of Optoscribe’s platform lends itself to address fiber density issues as speed (bandwidth) moves from 400Gb/s to 800Gb/s and beyond. It also supports advanced space division multiplexed transmission using the latest fibers, more specifically, Single Mode Fibers (SMF), Multimode Fibers (MMF) Multicore Fibers (MCF) and Few Mode Fibers (FMF). The 3D fiber coupling solutions can address challenges in a wide variety of transceivers including Silicon Photonics, VCSEL and DFB based designs and coupling to a range of standard fiber architectures..

Adaptix

Venture Round in 2019
Adaptix specializes in advancing diagnostic imaging technology by transforming traditional planar X-ray systems into more effective and accessible solutions. The company focuses on integrating low-dose 3D capabilities, known as digital tomosynthesis, into X-ray equipment while ensuring portability and affordability. This innovation aims to enhance patient access to critical imaging technologies and improve diagnostic accuracy for prevalent health issues such as cardiovascular and pulmonary diseases, lung cancer, and osteoporosis. Adaptix's approach utilizes a new Flat Panel X-ray source, developed using semiconductor technology, which allows for multiple low-dose acquisitions rather than relying on a single high-dose capture. This shift not only provides more comprehensive imaging data but also results in significant cost savings compared to current bulky and expensive X-ray systems. Adaptix’s technology is designed to be incorporated into products by X-ray system manufacturers, who will ultimately ensure compliance with regulatory standards.

Adaptix

Venture Round in 2019
Adaptix specializes in advancing diagnostic imaging technology by transforming traditional planar X-ray systems into more effective and accessible solutions. The company focuses on integrating low-dose 3D capabilities, known as digital tomosynthesis, into X-ray equipment while ensuring portability and affordability. This innovation aims to enhance patient access to critical imaging technologies and improve diagnostic accuracy for prevalent health issues such as cardiovascular and pulmonary diseases, lung cancer, and osteoporosis. Adaptix's approach utilizes a new Flat Panel X-ray source, developed using semiconductor technology, which allows for multiple low-dose acquisitions rather than relying on a single high-dose capture. This shift not only provides more comprehensive imaging data but also results in significant cost savings compared to current bulky and expensive X-ray systems. Adaptix’s technology is designed to be incorporated into products by X-ray system manufacturers, who will ultimately ensure compliance with regulatory standards.

Optoscribe

Series C in 2018
Optoscribe’s unique 3D glass-based photonic integrated circuit platform is ideally suited for creating custom transceiver fiber coupling and attaching solutions designed to specifically address the challenges of individual optical transceiver architectures and configurations. Designed to enable compact and robust optical interconnects, Optoscribe’s platform revolutionise the footprint and form factor of assemblies and dramatically increase the amount of data transferred across networks. This in turn minimises network costs whilst maximising cable performance. We use proven and tested manufacturing processes to enable simple volume scalability, and ensure that our products are designed to meet the stringent needs of communications markets. Easy to integrate into a wide range of advanced communications applications the 3D nature of Optoscribe’s platform lends itself to address fiber density issues as speed (bandwidth) moves from 400Gb/s to 800Gb/s and beyond. It also supports advanced space division multiplexed transmission using the latest fibers, more specifically, Single Mode Fibers (SMF), Multimode Fibers (MMF) Multicore Fibers (MCF) and Few Mode Fibers (FMF). The 3D fiber coupling solutions can address challenges in a wide variety of transceivers including Silicon Photonics, VCSEL and DFB based designs and coupling to a range of standard fiber architectures..

Adaptix

Venture Round in 2017
Adaptix specializes in advancing diagnostic imaging technology by transforming traditional planar X-ray systems into more effective and accessible solutions. The company focuses on integrating low-dose 3D capabilities, known as digital tomosynthesis, into X-ray equipment while ensuring portability and affordability. This innovation aims to enhance patient access to critical imaging technologies and improve diagnostic accuracy for prevalent health issues such as cardiovascular and pulmonary diseases, lung cancer, and osteoporosis. Adaptix's approach utilizes a new Flat Panel X-ray source, developed using semiconductor technology, which allows for multiple low-dose acquisitions rather than relying on a single high-dose capture. This shift not only provides more comprehensive imaging data but also results in significant cost savings compared to current bulky and expensive X-ray systems. Adaptix’s technology is designed to be incorporated into products by X-ray system manufacturers, who will ultimately ensure compliance with regulatory standards.

Optoscribe

Series B in 2017
Optoscribe’s unique 3D glass-based photonic integrated circuit platform is ideally suited for creating custom transceiver fiber coupling and attaching solutions designed to specifically address the challenges of individual optical transceiver architectures and configurations. Designed to enable compact and robust optical interconnects, Optoscribe’s platform revolutionise the footprint and form factor of assemblies and dramatically increase the amount of data transferred across networks. This in turn minimises network costs whilst maximising cable performance. We use proven and tested manufacturing processes to enable simple volume scalability, and ensure that our products are designed to meet the stringent needs of communications markets. Easy to integrate into a wide range of advanced communications applications the 3D nature of Optoscribe’s platform lends itself to address fiber density issues as speed (bandwidth) moves from 400Gb/s to 800Gb/s and beyond. It also supports advanced space division multiplexed transmission using the latest fibers, more specifically, Single Mode Fibers (SMF), Multimode Fibers (MMF) Multicore Fibers (MCF) and Few Mode Fibers (FMF). The 3D fiber coupling solutions can address challenges in a wide variety of transceivers including Silicon Photonics, VCSEL and DFB based designs and coupling to a range of standard fiber architectures..

Optoscribe

Series A in 2016
Optoscribe’s unique 3D glass-based photonic integrated circuit platform is ideally suited for creating custom transceiver fiber coupling and attaching solutions designed to specifically address the challenges of individual optical transceiver architectures and configurations. Designed to enable compact and robust optical interconnects, Optoscribe’s platform revolutionise the footprint and form factor of assemblies and dramatically increase the amount of data transferred across networks. This in turn minimises network costs whilst maximising cable performance. We use proven and tested manufacturing processes to enable simple volume scalability, and ensure that our products are designed to meet the stringent needs of communications markets. Easy to integrate into a wide range of advanced communications applications the 3D nature of Optoscribe’s platform lends itself to address fiber density issues as speed (bandwidth) moves from 400Gb/s to 800Gb/s and beyond. It also supports advanced space division multiplexed transmission using the latest fibers, more specifically, Single Mode Fibers (SMF), Multimode Fibers (MMF) Multicore Fibers (MCF) and Few Mode Fibers (FMF). The 3D fiber coupling solutions can address challenges in a wide variety of transceivers including Silicon Photonics, VCSEL and DFB based designs and coupling to a range of standard fiber architectures..
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