Aizhicun Technology
Venture Round in 2025
Aizhicun Technology offers integrated circuit (IC) design services, which typically involve providing expertise in designing custom chips and circuit solutions for various applications.
SiliconCore Technology
Seed Round in 2024
SiliconCore Technology is a chip EDA software design and development company that specializes in the research and development of next-generation 2.5D and 3D stacked chip EDA software.
Avant Semi
Venture Round in 2024
Avant Semi is a technology company focused on developing and manufacturing advanced measurement equipment for the semiconductor industry. Its products are designed to optimize front-end processes in semiconductor production by accurately measuring epitaxial layers, photoresist thickness, and other critical parameters.
Yuefang Technology
Series A in 2023
Yuefang Technology is a chip design company initiated and established by Galanz Group.
Ganext develops and manufactures high-end gallium nitride power devices using GaN-on-Si technology. The company focuses on R&D, design and production of GaN power devices to deliver higher efficiency, smaller size and lower cost for customers. Based in Zhuhai, the team is led by IEEE Fellow Dr. Wu Yifeng and includes a core group of researchers with extensive industrial R&D and market experience.
Shencong Semiconductor
Venture Round in 2021
Shencong Smart is a voice AI chip developer, focusing on voice application scenarios, mainly for smart homes, smart terminals, vehicles, mobile phones, wearable devices and other terminal devices. Its products have complete voice interaction functions and can realize voice processing. , voice recognition, voice broadcast and other operations, support offline voice interaction.
Ganext
Angel Round in 2021
Ganext develops and manufactures high-end gallium nitride power devices using GaN-on-Si technology. The company focuses on R&D, design and production of GaN power devices to deliver higher efficiency, smaller size and lower cost for customers. Based in Zhuhai, the team is led by IEEE Fellow Dr. Wu Yifeng and includes a core group of researchers with extensive industrial R&D and market experience.
Future Advanced Technology Research Institute
Venture Round in 2020
Future Advanced Technology Research Institute engages in chip and sensor design, manufacturing, packaging, and testing. The company develops MEMS chips and data acquisition sensors used in healthcare and AI applications.
Maxone Semi
Venture Round in 2018
Maxone Semiconductor (Suzhou) Co., Ltd. is a Chinese company focused on the research, development, design, and manufacturing of integrated circuits and semiconductor test solutions. Established in 2015 in Suzhou, the company specializes in producing IC wafer test probe cards, including cantilever probes, vertical probe cards, and 3D MEMS probes. These products are designed for the electrical testing of large-scale integrated circuits (LSI) during the wafer test process, supporting various applications such as RF front-end chips and multimedia system-on-chip (SoC) devices. Maxone Semi aims to enhance the efficiency of semiconductor testing while contributing to the growth of domestic chip technology in the integrated circuit industry.