Xin Ding Capital is a venture capital firm established in 2012 and based in Beijing, China. The firm specializes in investments across various sectors, including healthcare, new energy vehicles, semiconductors, and artificial intelligence. Through its strategic investments, Xin Ding Capital aims to support innovation and growth in these dynamic industries.
O-Cubes focus on micro chip research and development in wireless communication field.
Wuxi Xinxiang
Series B in 2023
Wuxi Xinxiang is a semiconductor factory production automation CIM solution and services provider. They focus on intelligent automation production solutions and services in the field of wafer manufacturing, packaging and testing.
HyperSilicon
Series A in 2023
HyperSilicon develops FPGA-based SoC/ASIC prototyping and hardware emulation accelerator tools. HyperSilicon has a team of nearly 60 R&D engineers. The core members have an average of more than 15 years of experience in R&D, sales, and technical services in related fields of well-known EDA companies at home and abroad.
DJEL
Venture Round in 2022
DJEL is a semiconductor equipment and software company that specializes in integrated circuit yield management. The company develops and manufactures advanced semiconductors and inspection machines designed to enhance the efficiency of chip design, manufacturing, and testing processes. By offering real-time optimized systems and technical solutions, DJEL aims to improve yields for chip manufacturers in the semiconductor industry.
B&C Chemical
Venture Round in 2022
B&C Chemical focuses on the research, development, and production of mid-to-high-end photoresists and related raw materials. B&C is dedicated to advancing the domestication process of essential semiconductor materials. The company has currently achieved the layout of the entire industrial chain of "monomer-resin, photoacid-photoresist", including ArF/KrF photoresist monomer, ArF/KrF photoresist, G line/I line photoresist, electron beam photoresist, and other products, which are widely used in the production of integrated circuits, back-end packaging, compound semiconductors, discrete devices, electron beam, and other market applications.
Black Sesame Technologies
Series C in 2022
Black Sesame Technologies is an AI digital imaging technology firm founded in 2016, with locations in Silicon Valley and Shanghai. The company specializes in developing solutions for real-world AI challenges, focusing on image processing, computing images, and embedded sensing platforms. It provides advanced algorithms for applications in smartphones, autonomous driving, and various consumer electronics. The firm conducts extensive research and development, including core algorithm development, ASIC design, and software systems for advanced driver-assistance systems (ADAS). Black Sesame Technologies is committed to innovation, quality, and reliable service, leveraging the extensive industry experience of its team members. The company has designed automotive-grade system-on-chips (SoCs), including the high-computing Huashan Series and the cross-domain Wudang Series, aimed at enhancing intelligent vehicle solutions and driving the future of mobility.
Zhongke Zhixin Integration
Series B in 2022
Zhongke Zhixin Integration is committed to advanced packaging and chip integration technology for integrated circuits. They offer packaging design, system simulation, and packaging technology services. Their objective is to develop the country's core technology and build a highly intelligent enterprise.
B&C Chemical
Venture Round in 2022
B&C Chemical focuses on the research, development, and production of mid-to-high-end photoresists and related raw materials. B&C is dedicated to advancing the domestication process of essential semiconductor materials. The company has currently achieved the layout of the entire industrial chain of "monomer-resin, photoacid-photoresist", including ArF/KrF photoresist monomer, ArF/KrF photoresist, G line/I line photoresist, electron beam photoresist, and other products, which are widely used in the production of integrated circuits, back-end packaging, compound semiconductors, discrete devices, electron beam, and other market applications.
Lynxi Technology
Series A in 2021
Lynxi Technology develops brain-like chips, modules, computing boards and servers, supporting software toolchains, and system software.
Hercules Microsystems
Venture Round in 2020
Jingwei Qili is a developer of hybrid programmable computing chips. The company's products are mainly FPGA chip series products, as well as development boards and kits, etc., which can be applied to the field of artificial intelligence. At the same time, the company's business also includes providing users with testing and maintenance Circuits and other services.
CapitalBio Technology
Series C in 2020
CapitalBio Technology is a prominent life science company based in Beijing, specializing in the development and commercialization of comprehensive healthcare solutions. Founded in August 2012 as a core subsidiary of CapitalBio Corporation and the Biological Chip Beijing National Engineering Research Center, the company offers a wide range of products including microarray and microfluidic chips, instruments, software, and databases. Their offerings cater to biomedical researchers, healthcare professionals, and institutions engaged in drug development, clinical diagnostics, biosafety, food safety, and molecular breeding. CapitalBio Technology has established a robust biochip technology platform and a modern biological detection technology system that encompasses various methodologies such as sequencing and multiplex PCR. With over 500 employees, the company boasts a highly educated workforce, with a significant proportion holding advanced degrees.
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