Legend Capital, established in 2001 and based in Beijing, China, is a prominent venture capital firm and a subsidiary of Legend Holdings Ltd. The firm focuses on investing in high-growth ventures primarily within China or related markets, managing approximately US$700 million across multiple funds. Legend Capital emphasizes early-stage investments in the information technology sector, particularly in network applications and services, as well as in infrastructure and professional services. Additionally, it targets mid-market growth companies in consumer goods, clean technology, healthcare, equipment manufacturing, and modern services. With a portfolio of over 60 companies, Legend Capital actively supports its investments by providing extensive business resources and tailored services, aimed at enhancing business development and brand building in the Chinese market.
10/F, Tower A, Raycom Info.Tech Center, No.2 Ke Xue Yuan Nanlu, Zhong Guan Cun, Haidian District, Beijing 100190, China
Daqing Cai
Managing Director
Hao Chen
Managing Director and Head of Investment
Raymond CHEN
Co-Chief Investment Officer
Rui Chen
Managing Director
Frank Hong
Managing Director
Henry Ji
Executive Director
Yi Kang
Director
Richard Li
President
Jiaqing Li
Managing Director
Xiangyu Ouyang
Managing Director
Joon Sung Park
Executive Director
FAN Qihui
Executive Director
Jenking Shao
Managing Director and Partner
Zhenxing Shao
Partner / Managing Director
Jeff Wang
Managing Director
Junfeng Wang
Managing Director
Nengguang Wang
Managing Director and CFO
Piau-Voon Wang
COO
Tony WANG
VP
Ge Xinyu
Managing Director
Quan Zhou
Managing Director, Partner
Hank Zhou
Executive Director
Hongbin Zhou
Managing Director
William Wen
Executive Director
Past deals in Semiconductor
Leadrive
Series D in 2023
LEADRIVE is a technology company specializing in the research, development, production, and sales of drive solutions for new energy vehicles, as well as high-performance domestic power semiconductor modules. The company develops advanced motor controllers and power modules tailored for new energy vehicles, which have been adopted by over ten models from leading domestic and international OEMs and Tier-1 suppliers. In addition to its focus on vehicle technology, LEADRIVE invests in innovative solutions for renewable energy sources, including wind and solar power, and energy storage systems. The company has achieved significant advancements in localizing power semiconductor modules and collaborates with Rohm Semiconductor to enhance the development of silicon carbide modules. This partnership aims to improve efficiency and performance across various applications, from semiconductor devices to vehicle-level integration.
SpacemiT
Series A in 2023
SpacemiT is a computing chip company that specializes in the development and manufacture of next-generation RISC-V architecture chips. The company aims to create natively integrated cloud-edge-device architectures, delivering powerful computing solutions that combine both hardware and software optimization. By focusing on high-performance CPUs, SpacemiT seeks to establish itself as a significant player in the global computing landscape, providing enhanced cloud computation capabilities and high-performance computing resources to its users. Through its innovative approach, the company is positioned to play a crucial role in meeting the growing demands for computing power in the digital age.
Using.AI
Seed Round in 2023
Using.AI is an AI application service provider focused on enhancing the advanced manufacturing industry through innovative technology. The company specializes in machine vision, robotics learning, and machine learning, developing self-learning solutions that optimize manufacturing processes. Its products are designed to benefit sectors such as OLED, optics components, and semiconductor devices, contributing to significant advancements in efficiency and performance within these markets.
SJ Semi
Series C in 2023
SJ Semi is a MEOL foundry focused on front-end wafer manufacturing and quality systems. The company specializes in bumping, Cu pillar, RDL, and testing services for 12" wafers while investing in R&D for fan-out, TSV, interposer, and 3D technologies. With over a decade of experience, SJ Semi aims to support advancements in the semiconductor market.
CMind-SEMI
Series A in 2023
CMind is committed to becoming the new global leader in smartphone communication chips by concentrating on 4G and 5G advanced wireless communication chips and complete solutions.
Sifli Technologies
Series A in 2022
Sifli Technologies focuses on the design and application development of embedded artificial intelligence IoT platforms.
Leadrive
Series C in 2022
LEADRIVE is a technology company specializing in the research, development, production, and sales of drive solutions for new energy vehicles, as well as high-performance domestic power semiconductor modules. The company develops advanced motor controllers and power modules tailored for new energy vehicles, which have been adopted by over ten models from leading domestic and international OEMs and Tier-1 suppliers. In addition to its focus on vehicle technology, LEADRIVE invests in innovative solutions for renewable energy sources, including wind and solar power, and energy storage systems. The company has achieved significant advancements in localizing power semiconductor modules and collaborates with Rohm Semiconductor to enhance the development of silicon carbide modules. This partnership aims to improve efficiency and performance across various applications, from semiconductor devices to vehicle-level integration.
Nuclei System Technology
Venture Round in 2022
Nuclei System Technology is a pioneer in China for the commercialization of RISC-V processor licensing. The company focuses on the development of high-performance and low-power processors, along with their associated system-on-chip (SoC) platforms, aimed at meeting the increasing demand for embedded system applications globally. Nuclei's semiconductor technology is tailored for smart electronics, telecommunications, and computer processing cores. It specializes in creating configurable 32/64-bit RISC-V processors designed for artificial intelligence of things (AIoT) applications, thus delivering innovative solutions to its customers.
CMind-SEMI
Series A in 2022
CMind is committed to becoming the new global leader in smartphone communication chips by concentrating on 4G and 5G advanced wireless communication chips and complete solutions.
TBSTest
Venture Round in 2022
TBSTest Technology is a developer and manufacturer of automatic test equipment for integrated circuits, specializing in ultra-large-scale integrated circuit testing. Founded in 2017 and headquartered in Beijing, China, with additional offices in Xi’an and Shanghai, as well as Suwon, South Korea, the company provides a comprehensive range of products, including test boards, software solutions, and memory systems. TBSTest Technology also offers pre-sales and after-sales support for its equipment, accessories, and software systems, along with application development projects. The company serves a diverse clientele, including clients engaged in integrated circuit design and production, as well as scientific research institutions and educational establishments.
Senscomm Semiconductor
Series A in 2022
Senscomm Semiconductor Co., Ltd. is a fabless semiconductor company founded in 2018 and based in Suzhou, China. The company focuses on developing and providing innovative semiconductor solutions for various applications, including augmented reality (AR), virtual reality (VR), the Internet of Things (IoT), and electric vehicles (EV). Since its inception, Senscomm has successfully launched over 20 products to meet the growing global demand in these high-tech sectors.
Eswin
Series C in 2021
Eswin provides IC application solutions in mobile devices, smart homes, smart transportation, industrial IoT, produces 12-inch monocrystalline silicon polished wafers and epitaxial wafers, and delivers rear-end IC packaging and testing services, according to its website. It operates R&D centers in China, the U.K., and South Korea, and has production facilities in Xi'an, Chengdu, Hefei and Suzhou.
Litecore
Venture Round in 2021
Litecore is a manufacturer of optoelectronic devices and processors for broadband, large data centers, and information security.
Qutronix
Seed Round in 2021
Quantronix is an optical quantum chip and optical quantum computer company. It is committed to promoting the industrialization of quantum information and intelligent technology with photonic chips as the core, providing quantum secure communication services and full-stack solutions for remote confidential control of the Internet of Things. At present, the company's three-dimensional integrated optical quantum chip prepared by femtosecond laser direct writing technology provides a very promising quantum computing and processing resource and lays the foundation for the development of a
Kunlun
Venture Round in 2021
Kunlun is an artificial intelligence chip designer and manufacturer.
Leadrive
Series B in 2020
LEADRIVE is a technology company specializing in the research, development, production, and sales of drive solutions for new energy vehicles, as well as high-performance domestic power semiconductor modules. The company develops advanced motor controllers and power modules tailored for new energy vehicles, which have been adopted by over ten models from leading domestic and international OEMs and Tier-1 suppliers. In addition to its focus on vehicle technology, LEADRIVE invests in innovative solutions for renewable energy sources, including wind and solar power, and energy storage systems. The company has achieved significant advancements in localizing power semiconductor modules and collaborates with Rohm Semiconductor to enhance the development of silicon carbide modules. This partnership aims to improve efficiency and performance across various applications, from semiconductor devices to vehicle-level integration.
ESWIN Computing
Series B in 2020
ESWIN Computing specializes in the research and development of RISC-V computing architecture, focusing on the design and testing of integrated circuits for Internet of Things (IoT) applications. The company develops chips used in display devices and wearable technology, providing comprehensive solutions in areas such as artificial intelligence, human-computer interaction, and the Internet of Vehicles. By combining innovative design with advanced materials, ESWIN Computing aims to enhance user experiences across various digital platforms.
Black Sesame Technologies
Series B in 2019
Black Sesame Technologies is an AI digital imaging technology firm founded in 2016, with locations in Silicon Valley and Shanghai. The company specializes in developing solutions for real-world AI challenges, focusing on image processing, computing images, and embedded sensing platforms. It provides advanced algorithms for applications in smartphones, autonomous driving, and various consumer electronics. The firm conducts extensive research and development, including core algorithm development, ASIC design, and software systems for advanced driver-assistance systems (ADAS). Black Sesame Technologies is committed to innovation, quality, and reliable service, leveraging the extensive industry experience of its team members. The company has designed automotive-grade system-on-chips (SoCs), including the high-computing Huashan Series and the cross-domain Wudang Series, aimed at enhancing intelligent vehicle solutions and driving the future of mobility.
Norel System
Venture Round in 2011
Norel Systems Limited is a fabless semiconductor company headquartered in Tianjin, China and with sales and support offices in Shenzhen. Norel Systems was founded in 2009 by Silicon Valley semiconductor veterans and China’s local marketing and sales experts. The company has closed two rounds of investments from Legend Capital, SAIF Partners and Legend Star. The company specializes in the design and development of complex SOC chips requiring high-speed mixed signal expertise. With in-house developed PHY IPs covering USB 3.0, SATA1/2/3, PCIe, HD-SDI, HDMI, Displayport, MIPI and Thunderbolt (Lightpeak), Norel Systems is positioned to lead the market in providing turn-key solutions for mobile devices, consumer electronics and PCs. The company develops the Advanced Video Transport (AVT) technology which is scalable, real-time, visually lossless and low cost. The company provides AVT chip solutions for the HD video surveillance market. Norel Systems’ capable teams are determined to deliver the best products and experiences for their customers world wide.
Parade Technologies
Series B in 2007
Parade Technologies, Ltd. is a fabless semiconductor company that specializes in designing, developing, and selling high-speed interface and display processing integrated circuit (IC) chips. Founded in 2005 and headquartered in George Town, Cayman Islands, Parade offers a range of products, including display port LCD timing controllers, format converters, transmitters, receivers, and touch controllers. The company focuses on high-speed video interfacing solutions that cater to applications in personal computers, consumer electronics, and display panels, such as digital TVs and set-top boxes. Parade Technologies operates internationally, with branch offices in Hong Kong and Taiwan, and a design center in Shanghai, China, to support its global customer base. It actively participates in industry standards organizations, contributing to the development of key technologies like the DisplayPort digital video interface standard.
UNISOC
Series C in 2004
UNISOC is a fabless semiconductor company specializing in the research and development of core chipsets for mobile communications and the Internet of Things (IoT). The company produces a wide range of products, including mobile chipset platforms that support various communication standards such as 2G, 3G, and 4G, as well as RF chipsets, wireless connection chipsets, security chipsets, TV chipsets, and image sensor chipsets. With a global workforce of over 4,500 employees and numerous research and development centers, UNISOC ranks among the top three suppliers of mobile baseband chipsets worldwide and is the largest pan-chip supplier in China. The company's offerings enable access to advanced technologies, including 5G and artificial intelligence, for consumer and industrial electronics.
Berkäna Wireless
Series B in 2002
Berkana Wireless is a technology company that manufactures parts for the mobile phone industry. The company’s product portfolio includes processors, Bluetooth products, cellular modems, Wi-Fi products, and more. Berkana Wireless was founded in February 2001 and is based in Campbell, California.
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