Lenovo Capital and Incubator Group

Lenovo Capital and Incubator Group is a global investment entity that focuses on core technology and internet-related sectors, including cloud computing, big data, artificial intelligence, and robotics. Based in Quarry Bay, Hong Kong, the group manages venture capital funds, such as the Lenovo Smart Internet Innovation RMB Fund, which specifically targets the Internet innovation industry in China. The group's strategy emphasizes leveraging Lenovo's extensive global resources to promote research and development, facilitating new business avenues, and fostering innovation. Through targeted investments and incubation efforts, Lenovo Capital and Incubator Group seeks to align with Lenovo's strategic objectives and drive future advancements in technology.

He Zhiqiang

President

Past deals in Semiconductor

IC Bench

Seed Round in 2022
IC Bench is a semiconductor technology company on a mission to advance the chip industry. IC Bench enables customers to progress from new product ideas to working products faster than currently possible. IC Bench's expertise is in transforming chip ideas into working chips at a pace unmatched in the industry.

Viiyong

Series B in 2022
Viiyong is a manufacturer specializing in multi-layer ceramic chip capacitors. The company emphasizes research and development to create high-end ceramic capacitors, targeting applications primarily within the automotive electronics sector. By focusing on advanced technology and innovative solutions, Viiyong aims to meet the demands of modern electronics, providing reliable and efficient capacitor products to its customers.

Houmo.AI

Series A in 2022
Houmo.AI is a semiconductor company that develops an integrated circuit storage technology for AI computing. The company aims to use disruptive technologies to create AI chips with a "ten-fold effect", to meet the huge computing power demand in the era of true artificial intelligence, and to use unlimited computing power to change the world. Houmo.AI was founded by Dr. Wu Qiang in 2020.

IC Bench

Seed Round in 2021
IC Bench is a semiconductor technology company on a mission to advance the chip industry. IC Bench enables customers to progress from new product ideas to working products faster than currently possible. IC Bench's expertise is in transforming chip ideas into working chips at a pace unmatched in the industry.

RiVAI

Series A in 2021
Developer of an artificial intelligence chip based on RISC-V(an open standard instruction set architecture based on established reduced instruction set computer principles) technology for IoT(Internet of Things) applications. The company's products can be used in a variety of IoT/AIoT application scenarios such as wearable devices, smart homes, smart security, agriculture, and consumer electronics, enabling clients to have low-power, high-performance core processor chips

Resnics

Seed Round in 2021
Resnics specializes in the manufacture of storage and network data processor chip solutions tailored for the communications and Internet sectors. The company is bolstered by a skilled technical team comprising experts in networking, storage, and systems, both domestically and internationally. Resnics possesses significant technical expertise in networking, switching, storage, and high-performance CPUs. The company aspires to establish itself as a high-tech innovation leader, focusing on advancing technology to meet the growing demands of data centers for large chip solutions.

Shiguang Semiconductor

Venture Round in 2021
Shiguang Semiconductor develops solid-state laser scanning lidar that fires laser pulses and detects bounced signals from objects. By extracting the distances and relative velocities to objects from the signal, and turning the beam in different directions, a 3D model of the environment is built and represented in data called a point cloud.

Houmo.AI

Seed Round in 2021
Houmo.AI is a semiconductor company that develops an integrated circuit storage technology for AI computing. The company aims to use disruptive technologies to create AI chips with a "ten-fold effect", to meet the huge computing power demand in the era of true artificial intelligence, and to use unlimited computing power to change the world. Houmo.AI was founded by Dr. Wu Qiang in 2020.

TacSense

Series A in 2020
TacSense, Inc. specializes in the manufacture of pressure-sensitive ionic materials and structures that incorporate electronic sensors. The company has developed Flexible Iontronic Sensing (FITS) Technology, which utilizes proprietary ionic materials to create an ionic-electronic interface in response to mechanical stimuli. TacSense's product offerings include µSens and tSens, which are used in various applications such as sleep monitoring, baby monitoring, elderly care, monitoring vital signs, cardiovascular devices, robotic systems for hazardous environments, and surgical robotics. Founded in 2016, TacSense is headquartered in Woodland, California, and also has offices in Shenzhen and Beijing, China.

Hercules Microsystems

Venture Round in 2020
Jingwei Qili is a developer of hybrid programmable computing chips. The company's products are mainly FPGA chip series products, as well as development boards and kits, etc., which can be applied to the field of artificial intelligence. At the same time, the company's business also includes providing users with testing and maintenance Circuits and other services.

SemiDrive

Series A in 2020
Nanjing SemiDrive Technology Ltd. is a semiconductor company based in Nanjing, China, established in 2018. The firm specializes in designing and manufacturing core processor chips for the automotive industry, focusing on applications such as advanced driver assistance systems (ADAS) and autonomous driving. Its product lineup includes the X9 chip for high-performance eCockpit applications, the V9 chip for ADAS and autonomous driving, and the G9 chip, which serves as a vehicle central gateway connecting multiple domains. SemiDrive also offers research and development services for intelligent core processors and provides system-level turnkey solutions. The company operates with a fabless manufacturing model, with additional R&D facilities in Beijing and an office in Shenzhen, addressing the growing demand for smart driving technologies and high-performance industrial microprocessors in the automotive sector.

BYD Semiconductor

Series A in 2020
BYD Semiconductor operates as an electronic components manufacturing company. BYD Semiconductor produces and sells battery management chips, power field effect transistors, image sensors, touch control chips, protection diode, current sensors, and other products.

Haiguang Information Technology

Venture Round in 2020
Haiguang Information Technology develops high-end processors, accelerators, and other computing chip products and systems.

Light Theto

Series B in 2019
Light Theto Beijing Science and Technology Development Co specializes in the research, development, manufacture, and supply of diffraction optics and micro-nano optical solutions. Based in Beijing, China, the company focuses on providing complete optical solutions for various applications, including three-dimensional sensing in LED and laser lighting, vehicle systems, security monitoring, human-computer interaction, and industrial automation. Light Theto boasts a top-tier research and development team and has established mature production technology. The company has developed proprietary diffractive optical design software and utilizes advanced nanometer manufacturing techniques. Its efficient mass production processes enable the company to produce high-quality diffractive optical elements at scale, positioning it as a leader in the industry.

SemiDrive

Seed Round in 2019
Nanjing SemiDrive Technology Ltd. is a semiconductor company based in Nanjing, China, established in 2018. The firm specializes in designing and manufacturing core processor chips for the automotive industry, focusing on applications such as advanced driver assistance systems (ADAS) and autonomous driving. Its product lineup includes the X9 chip for high-performance eCockpit applications, the V9 chip for ADAS and autonomous driving, and the G9 chip, which serves as a vehicle central gateway connecting multiple domains. SemiDrive also offers research and development services for intelligent core processors and provides system-level turnkey solutions. The company operates with a fabless manufacturing model, with additional R&D facilities in Beijing and an office in Shenzhen, addressing the growing demand for smart driving technologies and high-performance industrial microprocessors in the automotive sector.

Serica Integrated Circuits Technologies

Series A in 2019
Serica Integrated Circuits Technologies is a digital information encryption and decryption chip manufacturer.

Light Theto

Series B in 2019
Light Theto Beijing Science and Technology Development Co specializes in the research, development, manufacture, and supply of diffraction optics and micro-nano optical solutions. Based in Beijing, China, the company focuses on providing complete optical solutions for various applications, including three-dimensional sensing in LED and laser lighting, vehicle systems, security monitoring, human-computer interaction, and industrial automation. Light Theto boasts a top-tier research and development team and has established mature production technology. The company has developed proprietary diffractive optical design software and utilizes advanced nanometer manufacturing techniques. Its efficient mass production processes enable the company to produce high-quality diffractive optical elements at scale, positioning it as a leader in the industry.

Jeejio

Seed Round in 2018
Jeejio develops AI-based processors for applications on IoT-enabled devices and solutions. In addition, it develops intelligent operating systems for the chips that enable the developers to program the latter.

SmartSens Technology

Series A in 2018
SmartSens Technology is a high-performance CMOS image sensor chip design company.

Cambricon Technologies

Series A in 2017
Cambricon Technologies Corporation Limited creates core processor chips for various types of intelligent cloud servers, intelligent edge devices, and intelligent terminals. It offers terminal intelligent processor IPs, smart accelerator cards, and edge artificial intelligence acceleration cards; and Cambricon NeuWare, a software development platform for its cloud, edge, and end intelligent processor products. The company was founded in 2016 and is based in Beijing, China.
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